Tao‐Chih Chang

67 papers and 885 indexed citations i.

Tao‐Chih Chang has authored 67 papers that have received a total of 885 indexed citations. This includes 59 papers in Electrical and Electronic Engineering, 27 papers in Mechanical Engineering and 12 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (53 papers), 3D IC and TSV technologies (38 papers) and Intermetallics and Advanced Alloy Properties (14 papers). Tao‐Chih Chang is often cited by papers focused on Electronic Packaging and Soldering Technologies (53 papers), 3D IC and TSV technologies (38 papers) and Intermetallics and Advanced Alloy Properties (14 papers) and collaborates with scholars based in Taiwan, United States and Australia. Tao‐Chih Chang's co-authors include Min‐Hsiung Hon, Moo-Chin Wang, Chang‐Chun Lee, Dong‐Yih Lin and Yu-Min Lin and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Materials Science and Engineering A