Kwang‐Ho Jung

31 papers and 370 indexed citations i.

Kwang‐Ho Jung has authored 31 papers that have received a total of 370 indexed citations. This includes 26 papers in Electrical and Electronic Engineering, 10 papers in Biomedical Engineering and 6 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (13 papers) and Nanomaterials and Printing Technologies (11 papers). Kwang‐Ho Jung is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (13 papers) and Nanomaterials and Printing Technologies (11 papers) and collaborates with scholars based in South Korea. Kwang‐Ho Jung's co-authors include Seung‐Boo Jung, Choong-Jae Lee, Kwang‐Seok Kim, Yong‐Il Kim and Myung Yung Jeong and has published in prestigious journals such as Journal of Materials Chemistry A, Applied Surface Science and Journal of Alloys and Compounds