Kyung-Wook Paik
About
Kyung-Wook Paik has authored 17 papers that have received a total of 382 indexed citations.
This includes 13 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 3 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (9 papers) and Advanced Sensor and Energy Harvesting Materials (4 papers). Kyung-Wook Paik is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (9 papers) and Advanced Sensor and Energy Harvesting Materials (4 papers) and collaborates with scholars based in South Korea, China and United States. Kyung-Wook Paik's co-authors include Myung-Jin Yim, Shuye Zhang, Jun-Ho Lee, Seung‐Ho Kim and Yongwon Choi and has published in prestigious journals such as Journal of Materials Chemistry, Advances in Colloid and Interface Science and Materials Characterization.
In The Last Decade
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