Yongwon Choi
About
Yongwon Choi has authored 13 papers that have received a total of 255 indexed citations.
This includes 9 papers in Electrical and Electronic Engineering, 4 papers in Materials Chemistry and 4 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (5 papers) and Transition Metal Oxide Nanomaterials (3 papers). Yongwon Choi is often cited by papers focused on 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (5 papers) and Transition Metal Oxide Nanomaterials (3 papers) and collaborates with scholars based in South Korea and United States. Yongwon Choi's co-authors include Kyung‐Wook Paik, Il Kim, Young Soon Kim, Byeong‐Soo Bae and Kyung-Wook Paik and has published in prestigious journals such as Journal of Materials Chemistry, ACS Applied Materials & Interfaces and Thin Solid Films
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