Lei Nie

55 papers and 386 indexed citations i.

Lei Nie has authored 55 papers that have received a total of 386 indexed citations. This includes 23 papers in Electrical and Electronic Engineering, 10 papers in Biomedical Engineering and 10 papers in Control and Systems Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers) and stochastic dynamics and bifurcation (8 papers). Lei Nie is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers) and stochastic dynamics and bifurcation (8 papers) and collaborates with scholars based in China. Lei Nie's co-authors include Guanglan Liao, Mengran Liu, Xiang Li, Tielin Shi and Dong-Cheng Mei and has published in prestigious journals such as Optics Letters, Analytica Chimica Acta and Sensors