Lei Sun

61 papers and 1.5k indexed citations i.

Lei Sun has authored 61 papers that have received a total of 1.5k indexed citations. This includes 52 papers in Electrical and Electronic Engineering, 34 papers in Mechanical Engineering and 14 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (40 papers), 3D IC and TSV technologies (30 papers) and Aluminum Alloys Composites Properties (15 papers). Lei Sun is often cited by papers focused on Electronic Packaging and Soldering Technologies (40 papers), 3D IC and TSV technologies (30 papers) and Aluminum Alloys Composites Properties (15 papers) and collaborates with scholars based in China, United States and Japan. Lei Sun's co-authors include Yonghuan Guo, Honglie Shen and Mingyue Xiong and has published in prestigious journals such as Advanced Functional Materials, Chemical Communications and ACS Applied Materials & Interfaces