Lih‐Tyng Hwang

28 papers and 274 indexed citations i.

Lih‐Tyng Hwang has authored 28 papers that have received a total of 274 indexed citations. This includes 22 papers in Electrical and Electronic Engineering, 9 papers in Aerospace Engineering and 4 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (8 papers), Antenna Design and Analysis (7 papers) and Electronic Packaging and Soldering Technologies (6 papers). Lih‐Tyng Hwang is often cited by papers focused on 3D IC and TSV technologies (8 papers), Antenna Design and Analysis (7 papers) and Electronic Packaging and Soldering Technologies (6 papers) and collaborates with scholars based in Taiwan, United States and Israel. Lih‐Tyng Hwang's co-authors include I. Turlik, Arnold Reisman, Fa‐Shian Chang, Shunmin Wang and Tzyy‐Sheng Horng and has published in prestigious journals such as IEEE Transactions on Antennas and Propagation, Electronics Letters and Journal of Electronic Materials