Liqiang Cao
About
Liqiang Cao has authored 96 papers that have received a total of 1.1k indexed citations.
This includes 65 papers in Electrical and Electronic Engineering, 22 papers in Mechanical Engineering and 14 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (21 papers) and Electromagnetic Compatibility and Noise Suppression (11 papers). Liqiang Cao is often cited by papers focused on 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (21 papers) and Electromagnetic Compatibility and Noise Suppression (11 papers) and collaborates with scholars based in China, The Netherlands and United States. Liqiang Cao's co-authors include Fengze Hou, Meiying Su, Qidong Wang, Shuhui Yu and Lixi Wan and has published in prestigious journals such as Angewandte Chemie International Edition, Applied Physics Letters and Biochemistry
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