M. Rencz

17 papers and 178 indexed citations i.

M. Rencz has authored 17 papers that have received a total of 178 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 4 papers in Materials Chemistry and 4 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). M. Rencz is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers) and collaborates with scholars based in Hungary, France and Singapore. M. Rencz's co-authors include Vladimı́r Székely, V. Székely, B. Courtois, A. Poppe and R. S. Dhariwal and has published in prestigious journals such as Sensors and Actuators A Physical, Electronics Letters and Microelectronic Engineering