Martin Corfield
About
Martin Corfield has authored 30 papers that have received a total of 599 indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 8 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), Advanced Welding Techniques Analysis (6 papers) and Silicon Carbide Semiconductor Technologies (6 papers). Martin Corfield is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Advanced Welding Techniques Analysis (6 papers) and Silicon Carbide Semiconductor Technologies (6 papers) and collaborates with scholars based in United Kingdom, Nigeria and China. Martin Corfield's co-authors include C. Mark Johnson, Jianfeng Li, Pearl Agyakwa and I.R. Harris and has published in prestigious journals such as Chemical Engineering Journal, IEEE Transactions on Industrial Electronics and IEEE Transactions on Power Electronics
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