Pearl Agyakwa
About
Pearl Agyakwa has authored 28 papers that have received a total of 874 indexed citations.
This includes 22 papers in Electrical and Electronic Engineering, 18 papers in Mechanical Engineering and 6 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (21 papers), Aluminum Alloys Composites Properties (8 papers) and 3D IC and TSV technologies (6 papers). Pearl Agyakwa is often cited by papers focused on Electronic Packaging and Soldering Technologies (21 papers), Aluminum Alloys Composites Properties (8 papers) and 3D IC and TSV technologies (6 papers) and collaborates with scholars based in United Kingdom and Egypt. Pearl Agyakwa's co-authors include C. Mark Johnson, Jianfeng Li, Martin Corfield and Paul Evans and has published in prestigious journals such as Acta Materialia, Journal of Materials Science and Journal of Alloys and Compounds
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