Matthew Lueck
About
Matthew Lueck has authored 24 papers that have received a total of 250 indexed citations.
This includes 23 papers in Electrical and Electronic Engineering, 6 papers in Automotive Engineering and 5 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (12 papers), Electronic Packaging and Soldering Technologies (10 papers) and Additive Manufacturing and 3D Printing Technologies (6 papers). Matthew Lueck is often cited by papers focused on 3D IC and TSV technologies (12 papers), Electronic Packaging and Soldering Technologies (10 papers) and Additive Manufacturing and 3D Printing Technologies (6 papers) and collaborates with scholars based in United States and Germany. Matthew Lueck's co-authors include D. Temple, Alan Huffman, Dean Malta, John M. Lannon and Chris Gregory and has published in prestigious journals such as IEEE Transactions on Electron Devices, Japanese Journal of Applied Physics and IEEE Transactions on Microwave Theory and Techniques
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