Mauro J. Kobrinsky
About
Mauro J. Kobrinsky has authored 17 papers that have received a total of 413 indexed citations.
This includes 13 papers in Electrical and Electronic Engineering, 7 papers in Electronic, Optical and Magnetic Materials and 4 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (7 papers), Metal and Thin Film Mechanics (4 papers) and 3D IC and TSV technologies (4 papers). Mauro J. Kobrinsky is often cited by papers focused on Copper Interconnects and Reliability (7 papers), Metal and Thin Film Mechanics (4 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in United States, Germany and Ireland. Mauro J. Kobrinsky's co-authors include Carl V. Thompson, Peter Chang, Ricky J. Tseng, Bruce A. Block and Brian Corbett and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia
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