Michael K. Neilsen
About
Michael K. Neilsen has authored 21 papers that have received a total of 214 indexed citations.
This includes 16 papers in Mechanical Engineering, 11 papers in Electrical and Electronic Engineering and 11 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), Metallurgy and Material Forming (10 papers) and Metal Forming Simulation Techniques (7 papers). Michael K. Neilsen is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Metallurgy and Material Forming (10 papers) and Metal Forming Simulation Techniques (7 papers) and collaborates with scholars based in United States. Michael K. Neilsen's co-authors include Huei Eliot Fang, C. L. Chow, Paul T. Vianco, Terry D. Hinnerichs and Jerome A. Rejent and has published in prestigious journals such as International Journal for Numerical Methods in Engineering, International Journal of Solids and Structures and International Journal of Fracture
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