Min Ding

11 papers and 271 indexed citations i.

Min Ding has authored 11 papers that have received a total of 271 indexed citations. This includes 8 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 5 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (4 papers) and Dielectric materials and actuators (3 papers). Min Ding is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (4 papers) and Dielectric materials and actuators (3 papers) and collaborates with scholars based in China, United States and Denmark. Min Ding's co-authors include Paul S. Ho, Peng Su, Qiaohang Guo, Mingcen Weng and Kuan-Hsun Lu and has published in prestigious journals such as Journal of Applied Physics, Chemical Engineering Journal and Journal of Applied Polymer Science