Min Lei
About
Min Lei has authored 41 papers that have received a total of 420 indexed citations.
This includes 29 papers in Mechanical Engineering, 12 papers in Electrical and Electronic Engineering and 10 papers in Materials Chemistry. The topics of these papers are Advanced materials and composites (11 papers), Electronic Packaging and Soldering Technologies (8 papers) and High Entropy Alloys Studies (8 papers). Min Lei is often cited by papers focused on Advanced materials and composites (11 papers), Electronic Packaging and Soldering Technologies (8 papers) and High Entropy Alloys Studies (8 papers) and collaborates with scholars based in China, United Kingdom and Norway. Min Lei's co-authors include Yulong Li, L.X. Zhang, Wen-Qin Wang, J.C. Feng and Yulong Li and has published in prestigious journals such as Journal of Alloys and Compounds, Colloids and Surfaces A Physicochemical and Engineering Aspects and Surface and Coatings Technology
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