Yulong Li
About
Yulong Li has authored 257 papers that have received a total of 3.7k indexed citations.
This includes 114 papers in Electrical and Electronic Engineering, 108 papers in Mechanical Engineering and 40 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (51 papers), Intermetallics and Advanced Alloy Properties (38 papers) and 3D IC and TSV technologies (33 papers). Yulong Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (51 papers), Intermetallics and Advanced Alloy Properties (38 papers) and 3D IC and TSV technologies (33 papers) and collaborates with scholars based in China, United States and Canada. Yulong Li's co-authors include Xiaowu Hu, Xiongxin Jiang, Jin Yang, Zhixian Min and Hua Zhang and has published in prestigious journals such as Applied Physics Letters, Analytical Chemistry and Langmuir
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