Xiongxin Jiang
About
Xiongxin Jiang has authored 82 papers that have received a total of 1.5k indexed citations.
This includes 66 papers in Mechanical Engineering, 59 papers in Electrical and Electronic Engineering and 21 papers in Renewable Energy, Sustainability and the Environment. The topics of these papers are Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (31 papers) and Phase Change Materials Research (24 papers). Xiongxin Jiang is often cited by papers focused on Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (31 papers) and Phase Change Materials Research (24 papers) and collaborates with scholars based in China and United States. Xiongxin Jiang's co-authors include Xiaowu Hu, Yulong Li, Qinglin Li, Shikun Xiao and Wenjing Chen and has published in prestigious journals such as Chemical Engineering Journal, ACS Applied Materials & Interfaces and Applied Energy
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