Zhixian Min
About
Zhixian Min has authored 26 papers that have received a total of 481 indexed citations.
This includes 23 papers in Mechanical Engineering, 16 papers in Electrical and Electronic Engineering and 10 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (10 papers) and Solidification and crystal growth phenomena (9 papers). Zhixian Min is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (10 papers) and Solidification and crystal growth phenomena (9 papers) and collaborates with scholars based in China. Zhixian Min's co-authors include Xiaowu Hu, Yulong Li, Jun Shen, Hengzhi Fu and Xiao Yu and has published in prestigious journals such as Journal of Alloys and Compounds, Journal of Crystal Growth and Materials Letters
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