Min Shang
About
Min Shang has authored 39 papers that have received a total of 375 indexed citations.
This includes 13 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 5 papers in Management, Monitoring, Policy and Law. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (11 papers) and Landslides and related hazards (4 papers). Min Shang is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (11 papers) and Landslides and related hazards (4 papers) and collaborates with scholars based in China, United Kingdom and Hong Kong. Min Shang's co-authors include Haoran Ma, Chong Dong, Yunpeng Wang, Xiu Li and Haitao Ma and has published in prestigious journals such as Construction and Building Materials, Waste Management and Journal of Alloys and Compounds
In The Last Decade
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