Ming-Che Hsieh

19 papers and 125 indexed citations i.

Ming-Che Hsieh has authored 19 papers that have received a total of 125 indexed citations. This includes 13 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 3 papers in Human-Computer Interaction. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). Ming-Che Hsieh is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers) and collaborates with scholars based in Taiwan and China. Ming-Che Hsieh's co-authors include Ching‐Hsing Luo, Jen‐Her Wu, Kuo‐Ning Chiang, An-Bang Wang and Zhongyuan Sun and has published in prestigious journals such as Lab on a Chip, Information Processing & Management and Microelectronic Engineering.