Mingyue Xiong
About
Mingyue Xiong has authored 25 papers that have received a total of 559 indexed citations.
This includes 10 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 7 papers in Surgery. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloys Composites Properties (4 papers). Mingyue Xiong is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloys Composites Properties (4 papers) and collaborates with scholars based in China, Hong Kong and United Kingdom. Mingyue Xiong's co-authors include Lei Sun, Meng Zhao and Zhi‐Quan Liu and has published in prestigious journals such as Scientific Reports, Journal of Materials Science and Aging
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