N. Hosoda
About
N. Hosoda has authored 52 papers that have received a total of 1.5k indexed citations.
This includes 26 papers in Electrical and Electronic Engineering, 19 papers in Mechanics of Materials and 9 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (16 papers), Adhesion, Friction, and Surface Interactions (14 papers) and Electronic Packaging and Soldering Technologies (13 papers). N. Hosoda is often cited by papers focused on 3D IC and TSV technologies (16 papers), Adhesion, Friction, and Surface Interactions (14 papers) and Electronic Packaging and Soldering Technologies (13 papers) and collaborates with scholars based in Japan, Germany and China. N. Hosoda's co-authors include Tadatomo Suga, Stanislav N. Gorb, Hideki Takagi, Ryutaro Maeda and Dagmar Voigt and has published in prestigious journals such as Physical Review Letters, Advanced Materials and Applied Physics Letters
In The Last Decade
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