N. Sillon
About
N. Sillon has authored 15 papers that have received a total of 123 indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 5 papers in Biomedical Engineering and 2 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (7 papers) and Electrowetting in Microfluidics and Optics (2 papers). N. Sillon is often cited by papers focused on 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (7 papers) and Electrowetting in Microfluidics and Optics (2 papers) and collaborates with scholars based in France, Switzerland and Czechia. N. Sillon's co-authors include B. Fléchet, A. Farcy, Philip R. LeDuc, P. Ancey and F. de Crécy and has published in prestigious journals such as Proceedings of the IEEE, Sensors and Actuators B Chemical and Sensors and Actuators A Physical
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