P. A. Flinn
About
P. A. Flinn has authored 63 papers that have received a total of 3.0k indexed citations.
This includes 26 papers in Electronic, Optical and Magnetic Materials, 22 papers in Electrical and Electronic Engineering and 22 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (16 papers), Electronic Packaging and Soldering Technologies (9 papers) and Semiconductor materials and devices (8 papers). P. A. Flinn is often cited by papers focused on Copper Interconnects and Reliability (16 papers), Electronic Packaging and Soldering Technologies (9 papers) and Semiconductor materials and devices (8 papers) and collaborates with scholars based in United States, France and Germany. P. A. Flinn's co-authors include T. Marieb, S. L. Ruby, J. C. Bravman, A. A. Maradudin and B. L. Averbach and has published in prestigious journals such as Science, Applied Physics Letters and Journal of Applied Physics
In The Last Decade
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