P. Alpern

23 papers and 194 indexed citations i.

P. Alpern has authored 23 papers that have received a total of 194 indexed citations. This includes 20 papers in Electrical and Electronic Engineering, 8 papers in Mechanics of Materials and 5 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (11 papers) and Integrated Circuits and Semiconductor Failure Analysis (7 papers). P. Alpern is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (11 papers) and Integrated Circuits and Semiconductor Failure Analysis (7 papers) and collaborates with scholars based in Germany. P. Alpern's co-authors include R. Tilgner, M. Stecher, Hartmut Günther, R. Dudek and R. Kakoschke and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society