R. Tilgner

32 papers and 310 indexed citations i.

R. Tilgner has authored 32 papers that have received a total of 310 indexed citations. This includes 19 papers in Mechanics of Materials, 15 papers in Electrical and Electronic Engineering and 8 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), Thermography and Photoacoustic Techniques (10 papers) and 3D IC and TSV technologies (9 papers). R. Tilgner is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Thermography and Photoacoustic Techniques (10 papers) and 3D IC and TSV technologies (9 papers) and collaborates with scholars based in Germany. R. Tilgner's co-authors include P. Alpern, T. Baumann, E. Lüscher, M. Stecher and Hartmut Günther and has published in prestigious journals such as Journal of Applied Physics, SAE technical papers on CD-ROM/SAE technical paper series and Colloid & Polymer Science