P. Bo rgesen
About
P. Bo rgesen has authored 18 papers that have received a total of 827 indexed citations.
This includes 9 papers in Electrical and Electronic Engineering, 8 papers in Computational Mechanics and 7 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Ion-surface interactions and analysis (8 papers), Copper Interconnects and Reliability (7 papers) and Electronic Packaging and Soldering Technologies (5 papers). P. Bo rgesen is often cited by papers focused on Ion-surface interactions and analysis (8 papers), Copper Interconnects and Reliability (7 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in United States, Denmark and Germany. P. Bo rgesen's co-authors include D. A. Lilienfeld, C.-Y. Li, M. A. Korhonen, T. L. Alford and J. W. Mayer and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Physical review. B, Condensed matter
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