Panju Shang
About
Panju Shang has authored 27 papers that have received a total of 1.1k indexed citations.
This includes 18 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 11 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), Intermetallics and Advanced Alloy Properties (9 papers) and 3D IC and TSV technologies (8 papers). Panju Shang is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), Intermetallics and Advanced Alloy Properties (9 papers) and 3D IC and TSV technologies (8 papers) and collaborates with scholars based in China, United States and Hong Kong. Panju Shang's co-authors include Zhi‐Quan Liu, Jin Shang, Xueyong Pang, Jian Ku Shang and Wenjie Shen and has published in prestigious journals such as Applied Physics Letters, Chemistry of Materials and Acta Materialia
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