Paul A. Flinn

45 papers and 1.4k indexed citations i.

Paul A. Flinn has authored 45 papers that have received a total of 1.4k indexed citations. This includes 32 papers in Electrical and Electronic Engineering, 25 papers in Electronic, Optical and Magnetic Materials and 12 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (23 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (14 papers). Paul A. Flinn is often cited by papers focused on Copper Interconnects and Reliability (23 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (14 papers) and collaborates with scholars based in United States, France and Australia. Paul A. Flinn's co-authors include J. C. Bravman, T. Marieb, Michael C. Madden, Paul R. Besser and William D. Nix and has published in prestigious journals such as The Journal of Chemical Physics, Applied Physics Letters and Journal of Applied Physics