Pierric Gueguen
About
Pierric Gueguen has authored 10 papers that have received a total of 180 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 4 papers in Automotive Engineering and 3 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (7 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers). Pierric Gueguen is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (7 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers) and collaborates with scholars based in France, Czechia and Switzerland. Pierric Gueguen's co-authors include L. Di Cioccio, L. Clavelier, Daniel Scevola, P. Gergaud and F. Rieutord and has published in prestigious journals such as Journal of The Electrochemical Society, Thin Solid Films and Microelectronic Engineering
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