Qingsheng Zhu
About
Qingsheng Zhu has authored 49 papers that have received a total of 756 indexed citations.
This includes 35 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 14 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (13 papers) and Electrodeposition and Electroless Coatings (12 papers). Qingsheng Zhu is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (13 papers) and Electrodeposition and Electroless Coatings (12 papers) and collaborates with scholars based in China, United States and Japan. Qingsheng Zhu's co-authors include Jingdong Guo, Zijun Wang, Jin Shang, Zhi‐Quan Liu and Xiaojing Wang and has published in prestigious journals such as Journal of The Electrochemical Society, The American Journal of Cardiology and Physical Chemistry Chemical Physics
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