Richard P. Vinci
About
Richard P. Vinci has authored 92 papers that have received a total of 2.3k indexed citations.
This includes 49 papers in Mechanics of Materials, 43 papers in Electrical and Electronic Engineering and 37 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Metal and Thin Film Mechanics (44 papers), Copper Interconnects and Reliability (35 papers) and Electronic Packaging and Soldering Technologies (18 papers). Richard P. Vinci is often cited by papers focused on Metal and Thin Film Mechanics (44 papers), Copper Interconnects and Reliability (35 papers) and Electronic Packaging and Soldering Technologies (18 papers) and collaborates with scholars based in United States, Germany and Taiwan. Richard P. Vinci's co-authors include J. C. Bravman, W. L. Brown, Richard R. Chromik, Helen M. Chan and E. M. Zielinski and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Geochimica et Cosmochimica Acta.
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