Rozalia Beica
About
Rozalia Beica has authored 16 papers that have received a total of 61 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 4 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (9 papers) and Copper Interconnects and Reliability (5 papers). Rozalia Beica is often cited by papers focused on 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (9 papers) and Copper Interconnects and Reliability (5 papers) and collaborates with scholars based in United States, India and China. Rozalia Beica's co-authors include Alojz Ivanković, Eric Kuah, Kai Wu, Xi Cao and Nelson Fan and has published in prestigious journals such as IEEE Transactions on Components Packaging and Manufacturing Technology and ECS Transactions.
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