S. Moreau

70 papers and 539 indexed citations i.

S. Moreau has authored 70 papers that have received a total of 539 indexed citations. This includes 46 papers in Electrical and Electronic Engineering, 19 papers in Electronic, Optical and Magnetic Materials and 12 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (33 papers), Electronic Packaging and Soldering Technologies (22 papers) and Copper Interconnects and Reliability (19 papers). S. Moreau is often cited by papers focused on 3D IC and TSV technologies (33 papers), Electronic Packaging and Soldering Technologies (22 papers) and Copper Interconnects and Reliability (19 papers) and collaborates with scholars based in France, United States and India. S. Moreau's co-authors include S. Lhostis, D. Bouchu, H. Frémont, Martin Hitier and L. Arnaud and has published in prestigious journals such as Nano Letters, Journal of Applied Physics and Analytica Chimica Acta