S. Voges

12 papers and 44 indexed citations i.

S. Voges has authored 12 papers that have received a total of 44 indexed citations. This includes 8 papers in Electrical and Electronic Engineering, 4 papers in Industrial and Manufacturing Engineering and 2 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (5 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers). S. Voges is often cited by papers focused on 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (5 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers) and collaborates with scholars based in Germany and United States. S. Voges's co-authors include Tanja Braun, R. Aschenbrenner, Martin Schneider‐Ramelow, Karl‐Friedrich Becker and R. Kahle and has published in prestigious journals such as Micromachines