S.A. Gee

10 papers and 231 indexed citations i.

S.A. Gee has authored 10 papers that have received a total of 231 indexed citations. This includes 8 papers in Electrical and Electronic Engineering, 2 papers in Biomedical Engineering and 2 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and 3D IC and TSV technologies (4 papers). S.A. Gee is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in United States, The Netherlands and Italy. S.A. Gee's co-authors include Luu Nguyen, Chris van Kessel, R. Falster, J. F. Gibbons and Jeremiah G. Murphy and has published in prestigious journals such as Applied Physics Letters, Journal of Electronic Packaging and IEEE Transactions on Components Packaging and Manufacturing Technology Part A