Sang-Won Kim

9 papers and 451 indexed citations i.

Sang-Won Kim has authored 9 papers that have received a total of 451 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 1 paper in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Advanced Welding Techniques Analysis (6 papers) and 3D IC and TSV technologies (6 papers). Sang-Won Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Advanced Welding Techniques Analysis (6 papers) and 3D IC and TSV technologies (6 papers) and collaborates with scholars based in South Korea. Sang-Won Kim's co-authors include Seung‐Boo Jung, Jeong‐Won Yoon, Kee-Won Kwon, Jong-Moon Choi and Yong‐Hyun Kim and has published in prestigious journals such as Journal of Alloys and Compounds, Journal of Electronic Materials and MATERIALS TRANSACTIONS