Seungbae Park
About
Seungbae Park has authored 76 papers that have received a total of 1.5k indexed citations.
This includes 57 papers in Electrical and Electronic Engineering, 24 papers in Mechanics of Materials and 19 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (45 papers), 3D IC and TSV technologies (31 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (7 papers). Seungbae Park is often cited by papers focused on Electronic Packaging and Soldering Technologies (45 papers), 3D IC and TSV technologies (31 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (7 papers) and collaborates with scholars based in United States, South Korea and China. Seungbae Park's co-authors include Ke Pan, Da Yu, Dapeng Liu, Jae B. Kwak and Ruiyang Liu and has published in prestigious journals such as Acta Materialia, Journal of the American Ceramic Society and Sensors.
In The Last Decade
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