Shenglin Ma

42 papers and 332 indexed citations i.

Shenglin Ma has authored 42 papers that have received a total of 332 indexed citations. This includes 33 papers in Electrical and Electronic Engineering, 10 papers in Biomedical Engineering and 5 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (13 papers) and Semiconductor materials and devices (6 papers). Shenglin Ma is often cited by papers focused on 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (13 papers) and Semiconductor materials and devices (6 papers) and collaborates with scholars based in China, United States and Switzerland. Shenglin Ma's co-authors include Yufeng Jin and Yufeng Jin and has published in prestigious journals such as ACS Nano, Applied Physics Letters and Chemical Engineering Journal