Yufeng Jin
About
Yufeng Jin has authored 53 papers that have received a total of 225 indexed citations.
This includes 40 papers in Electrical and Electronic Engineering, 6 papers in Materials Chemistry and 6 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (14 papers) and Semiconductor materials and devices (8 papers). Yufeng Jin is often cited by papers focused on 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (14 papers) and Semiconductor materials and devices (8 papers) and collaborates with scholars based in China, Singapore and United States. Yufeng Jin's co-authors include Shenglin Ma, Yan Yang and Min Miao and has published in prestigious journals such as American Journal of Clinical Nutrition, Nanoscale and Nutrients
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