Songbai Xue
About
Songbai Xue has authored 172 papers that have received a total of 2.9k indexed citations.
This includes 144 papers in Mechanical Engineering, 129 papers in Electrical and Electronic Engineering and 32 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (128 papers), 3D IC and TSV technologies (76 papers) and Advanced Welding Techniques Analysis (59 papers). Songbai Xue is often cited by papers focused on Electronic Packaging and Soldering Technologies (128 papers), 3D IC and TSV technologies (76 papers) and Advanced Welding Techniques Analysis (59 papers) and collaborates with scholars based in China, United States and Hong Kong. Songbai Xue's co-authors include Lili Gao, Jianxin Wang, Wei Dai and YU Sheng-lin and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Journal of Alloys and Compounds
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