Sueo KAWAI

36 papers and 279 indexed citations i.

Sueo KAWAI has authored 36 papers that have received a total of 279 indexed citations. This includes 21 papers in Mechanical Engineering, 20 papers in Electrical and Electronic Engineering and 18 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (14 papers) and Fatigue and fracture mechanics (12 papers). Sueo KAWAI is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (14 papers) and Fatigue and fracture mechanics (12 papers) and collaborates with scholars based in Japan. Sueo KAWAI's co-authors include A. Nishimura, Kunihiko NISHI, Hideo Miura, Makoto Kitano and Ken‐ichi Kasai and has published in prestigious journals such as Materials Science and Engineering A, Engineering Fracture Mechanics and Fatigue & Fracture of Engineering Materials & Structures