Sung-Hwan Hwang
About
Sung-Hwan Hwang has authored 23 papers that have received a total of 374 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 4 papers in Materials Chemistry and 4 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and 3D IC and TSV technologies (4 papers). Sung-Hwan Hwang is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in United States, South Korea and Taiwan. Sung-Hwan Hwang's co-authors include Kenneth H. Sandhage, Byoung‐Joon Kim, Young‐Chang Joo, Arief Suriadi Budiman and Volkan Ortalan and has published in prestigious journals such as Journal of Materials Science, Solar Energy and IEEE Transactions on Industry Applications
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