Su-Tsai Lu
About
Su-Tsai Lu has authored 14 papers that have received a total of 179 indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 4 papers in Mechanics of Materials and 2 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (10 papers) and Additive Manufacturing and 3D Printing Technologies (2 papers). Su-Tsai Lu is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (10 papers) and Additive Manufacturing and 3D Printing Technologies (2 papers) and collaborates with scholars based in Taiwan and United States. Su-Tsai Lu's co-authors include Wen‐Hwa Chen, Hsien‐Chie Cheng, Shih-Ming Lin, Tai‐Hong Chen and You-Wei Chen and has published in prestigious journals such as Journal of Electronic Materials, Microelectronics Reliability and IEEE Transactions on Device and Materials Reliability
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