Wen‐Hwa Chen
About
Wen‐Hwa Chen has authored 126 papers that have received a total of 1.6k indexed citations.
This includes 71 papers in Mechanics of Materials, 36 papers in Electrical and Electronic Engineering and 28 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (27 papers), Fatigue and fracture mechanics (26 papers) and Numerical methods in engineering (26 papers). Wen‐Hwa Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (27 papers), Fatigue and fracture mechanics (26 papers) and Numerical methods in engineering (26 papers) and collaborates with scholars based in Taiwan, United States and China. Wen‐Hwa Chen's co-authors include Hsien‐Chie Cheng, Su-Tsai Lu, Chun‐Hung Wu, Yu‐Chen Hsu and Kuo‐Ning Chiang and has published in prestigious journals such as Applied Physics Letters, Journal of Fluid Mechanics and Journal of Computational Physics
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