Su-Yueh Tsai
About
Su-Yueh Tsai has authored 26 papers that have received a total of 732 indexed citations.
This includes 19 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 6 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (13 papers) and Copper Interconnects and Reliability (5 papers). Su-Yueh Tsai is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (13 papers) and Copper Interconnects and Reliability (5 papers) and collaborates with scholars based in Taiwan, United States and China. Su-Yueh Tsai's co-authors include Jenq‐Gong Duh, Shou-Yi Chang, Yuan‐Tai Lai, J.G. Duh and D. Frank Benson and has published in prestigious journals such as Materials Science and Engineering A, Journal of Magnetism and Magnetic Materials and Surface and Coatings Technology
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