Sven Rzepka

53 papers and 326 indexed citations i.

Sven Rzepka has authored 53 papers that have received a total of 326 indexed citations. This includes 46 papers in Electrical and Electronic Engineering, 16 papers in Biomedical Engineering and 13 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (23 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (10 papers). Sven Rzepka is often cited by papers focused on Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (23 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (10 papers) and collaborates with scholars based in Germany, United States and France. Sven Rzepka's co-authors include E. Meusel, M. A. Korhonen, B. Michel, R. Dudek and Alexander Otto and has published in prestigious journals such as Journal of Electronic Materials, Microelectronic Engineering and Microelectronics Reliability