T. Reinikainen
About
T. Reinikainen has authored 19 papers that have received a total of 249 indexed citations.
This includes 10 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 9 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (5 papers) and Metallurgy and Material Forming (4 papers). T. Reinikainen is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (5 papers) and Metallurgy and Material Forming (4 papers) and collaborates with scholars based in United States, Finland and The Netherlands. T. Reinikainen's co-authors include Ari Korhonen, Abhijit Dasgupta, J.K. Kivilahti, Tuukka Ahoniemi and Essi Lahtinen and has published in prestigious journals such as Journal of Physics D Applied Physics, Journal of Materials Processing Technology and CIRP Annals
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