T. Sullivan

7 papers and 173 indexed citations i.

T. Sullivan has authored 7 papers that have received a total of 173 indexed citations. This includes 5 papers in Electrical and Electronic Engineering, 3 papers in Electronic, Optical and Magnetic Materials and 2 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (3 papers), Semiconductor materials and devices (3 papers) and Electronic Packaging and Soldering Technologies (2 papers). T. Sullivan is often cited by papers focused on Copper Interconnects and Reliability (3 papers), Semiconductor materials and devices (3 papers) and Electronic Packaging and Soldering Technologies (2 papers) and collaborates with scholars based in United States and Canada. T. Sullivan's co-authors include R. G. Filippi, Chunhua Hu, D.L. Rath, R.V.S.S.N. Ravikumar and J.B. Savy and has published in prestigious journals such as Thin Solid Films, International Journal of Plasticity and Earthquake Spectra